OCZ Technology Introduces the Innovative, High-Performance Vendetta to its Lineup of CPU Cooling Solutions

Sunnyvale, CA—September 12, 2007—OCZ Technology Group, Inc. a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today unveiled the OCZ Vendetta CPU cooler as their leading-edge yet affordable solution. Using a distinctive, highly efficient heat pipe and fin design developed by Xigmatek in combination with a low-noise fan, the Vendetta is built to tackle heat-induced performance degradation and to solve the cooling challenges of today’s enthusiast system builds.

While traditional heat pipe CPU coolers implement a solid base plate design, the Vendetta’s three copper heat pipes make direct contact with the processor to ensure the most rapid heat transfer. A novel “dimple” micro-configuration of the stacked aluminum fins adds turbulences, thereby reducing the skin effect of laminar air flow. Moreover, a folded "V" shape macro-configuration of the fins adds surface area without compromising the compact design. As a result, the Vendetta offers effective cooling area found usually only in much larger coolers to parallel their performance without the spatial requirements.

“We are pleased to see our inventions put into mainstream production by OCZ Technology,” commented Gary Huang, CEO of Xigmatek. “OCZ Technology’s commitment to innovation is a perfect counterpart for Xigmatek’s engineering capabilities and the combination of our strength will give us the best performance – price solution in the consumer cooling market.”